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Experimental Investigation of Rectangular Microchannels with Different Manifold Arrangements

File Size:
696.38 kB
Volume:
Volume 2, Issue 5 (May, 2016)
Publication No:
IJTC201605006
Author:
Vikrant Varma, Harpreet Singh
Downloads:
9 x

ABSTRACT
The thermal management of microelectronic using liquid cooling technique has been effective from the research community across the globe In this work we have been used rectangular micro channels in different manifold arrangements i.e in rectangular manifolds and rectangular manifold with semi-circular arrangements. Three different heat inputs 100 W,200 W and 300W applied in rectangular micro channels in different manifold arrangements. The rectangular micro channels were made of aluminium 6061. Assembly of aluminium test pieces and acrylic cover plate is made with the help of tightening screws. Thermocouples are inserted in the top surface of inlet & outlet adapters. These thermocouples further attached to the temperature indicator and data acquisition system to provide the actual value of temperature at that position..So As the reynold number increases by applying different heat inputs the nusselt number also increases. Also find out the friction drop in micro channels at different manifold arrangements. After experimental investigation it has been found that Heat transfer through rectangle with semicircle manifold is higher than the rectangular manifold arrangements. Heat transfer coefficient also increases as the reynold number increases. Heat transfer coefficient is higher in in rectangle with semicircle manifold arrangement compared to rectangular manifold arrangement. Thermal performance of rectangle with semicircle manifold arrangement slightly better than the rectangular manifold arrangements.

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